I have a PCB stack up with 3 layers with all three having different substrates. They are sandwhiched beween four layers of copper, and I need to ground the bottom three layers of copper. When I create/modify the substrate in Momentum, on the metallization tab,I have set up my three substrates. I set up three vias through 'hole'. Is this correct? How am I to connect these via's to ground? are they all to be mapped via hole?
Thanks in advance
Thanks in advance