Hi All,
Over the past few days I have getting pretty frustrated :-[ with Momentum (ADS2006) and am beginning to wonder if we have made the right decision in getting this tool all together.
What I would like to know is if anyone has been able to simulate resonably complex substrate layouts with at least 4 layers? Not simple inductors or hairpin filters etc.
My substrate ~8x6mm has and 2 die an RF (about 30 bond wires) and baseband (about 90 bond wires). There are a few passives too. Basically a typical SiP.
My workstation is a brand new 64Bit Dell 8), 4 GB RAM, 3.2GHz processor, WinXP 64, I have setup 100GB virtual ram. There are very few other apps installed on this machine too, basically a clean installation.
It would be good to know what other engineers have been able to do.
Thanks,
Over the past few days I have getting pretty frustrated :-[ with Momentum (ADS2006) and am beginning to wonder if we have made the right decision in getting this tool all together.
What I would like to know is if anyone has been able to simulate resonably complex substrate layouts with at least 4 layers? Not simple inductors or hairpin filters etc.
My substrate ~8x6mm has and 2 die an RF (about 30 bond wires) and baseband (about 90 bond wires). There are a few passives too. Basically a typical SiP.
My workstation is a brand new 64Bit Dell 8), 4 GB RAM, 3.2GHz processor, WinXP 64, I have setup 100GB virtual ram. There are very few other apps installed on this machine too, basically a clean installation.
It would be good to know what other engineers have been able to do.
Thanks,
You want to model the whole module?
For sure you can use momentum in your application. However your substrate is quite large 8x6mm with 4 layers plus complex line-ups in the layout. Its difficult to simulate that into a single simulation setup.
What I normally do in that kind of situations was, I broke the substrate into 4 equal parts such that I can reduce the physical size as well as the number of ports. Such that the momentum can able to hundle the memory size of my simulation, "make you circuit less complicated".
Model the substrate first then use TUDelf model to model your bondwires. That should be a lot of work for sure.
In may cased I had been able to modeled the whole PA module 8x8 mm with 4 layers using momentum simulator of ADS2005A.
Using momentum you need more patience for setting up your simulation bech but it will give you acurate results if you made you settings correct.