hi,
I am relatively new to ADS and i am doing em/circuit cosimulation in ADS. But i have questions about it. I am currently designing an filter module in a transmitter operating between 500Mhz to 1 Ghz. I have developed the schematic with vendor components for capacitors, resistors and inductors. Now i need to convert it into a loyout and add traces. generate a momentum component and use that in the schematic.
1.i would like to know whether there are any rules for determining the traces connecting the components.
2.I heard that we need to use 50ohm lines to connect the components. But if that is true, then what should the dimensions of the TEE joints in the layout be. (we can ofcourse determine the MLIN dimensions using line calc. what about the joints in the layout)
3.how do i determine the dimensions of the SMT pads to be used in the layout. or would it matter if i use the default SMT pad dimensions provided by the ADS
thanks in advance for your help.
I am relatively new to ADS and i am doing em/circuit cosimulation in ADS. But i have questions about it. I am currently designing an filter module in a transmitter operating between 500Mhz to 1 Ghz. I have developed the schematic with vendor components for capacitors, resistors and inductors. Now i need to convert it into a loyout and add traces. generate a momentum component and use that in the schematic.
1.i would like to know whether there are any rules for determining the traces connecting the components.
2.I heard that we need to use 50ohm lines to connect the components. But if that is true, then what should the dimensions of the TEE joints in the layout be. (we can ofcourse determine the MLIN dimensions using line calc. what about the joints in the layout)
3.how do i determine the dimensions of the SMT pads to be used in the layout. or would it matter if i use the default SMT pad dimensions provided by the ADS
thanks in advance for your help.
The SMT pad dimensions should correspond to the models being used. Sometimes, the manufacturers provide models that are quasi-independent of the substrate properties and pads, but in general, the models are tied to a specific manufacturing process. You should work with the component vendors to find out about the model reference planes, etc. Then you can adjust the pad dimensions as necessary.