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question about empower for multilayer boards

Question asked by hg on Oct 25, 2006
Latest reply on Oct 25, 2006 by ABOMPA
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Hi,

i would like to model a 3 port (1 input and 2 outputs) structure that is distributed on both sides of a multilayer board (4 layer)

the stackup is
top metal , 8 mil dielectric, metal ground, thick dielectric, metal ground, 8 mil dielectric, bottom metal

the 2 sides top metal and bottom metal are connected together with vias, it does not appear to be possible to do this with the 2006-10 version of empower. it seems to be limited to 2 sided boards only?????

thank you

HG

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