Hi,
i would like to model a 3 port (1 input and 2 outputs) structure that is distributed on both sides of a multilayer board (4 layer)
the stackup is
top metal , 8 mil dielectric, metal ground, thick dielectric, metal ground, 8 mil dielectric, bottom metal
the 2 sides top metal and bottom metal are connected together with vias, it does not appear to be possible to do this with the 2006-10 version of empower. it seems to be limited to 2 sided boards only?????
thank you
HG
:?:
i would like to model a 3 port (1 input and 2 outputs) structure that is distributed on both sides of a multilayer board (4 layer)
the stackup is
top metal , 8 mil dielectric, metal ground, thick dielectric, metal ground, 8 mil dielectric, bottom metal
the 2 sides top metal and bottom metal are connected together with vias, it does not appear to be possible to do this with the 2006-10 version of empower. it seems to be limited to 2 sided boards only?????
thank you
HG
:?: