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Mesh Alignment in the case of thin substrates

Question asked by Chemic on Oct 16, 2009
Good Morning,

I am reading the book "Microwave Circuit Modeling Using Electromagnetic Field Simulation"by Swanson and Hoefer. In chapter 5 they discuss on the importance for MoM, of having the same mesh geometry on two overlapped metal layers separated by a thin dielectric.

I verified on my design (4 layers of metal, with 100um of dielectric between them, meshed at 3GHz without metal expansion) and effectively every layer is meshed "independently" except for the VIA holes interconnections.

From the reading, I was expecting to have, on a ground plane with a track above or below, the track contour meshed there... Should I worry about that?

Thanks for the help