Hello,
if you are doing EM analysis of RFIC inductors or other passive on-chip structures, then this appnote might be for you.
In RFIC, larger vias are created as via arrays. The size of each single via is usually fixed by the technology rules, and via arrays are created where a larger via cross section is needed. This application note describes efficient modelling of via arrays in Agilent ADS with the Momentum EM solver. Two methods are discussed: via merging with an AEL script, and via merging with "derived layers" in ADS 2012.
http://muehlhaus.com/?p=1411
If you have any feedback, comments or questions, please post them here!
Best regards
Volker
if you are doing EM analysis of RFIC inductors or other passive on-chip structures, then this appnote might be for you.
In RFIC, larger vias are created as via arrays. The size of each single via is usually fixed by the technology rules, and via arrays are created where a larger via cross section is needed. This application note describes efficient modelling of via arrays in Agilent ADS with the Momentum EM solver. Two methods are discussed: via merging with an AEL script, and via merging with "derived layers" in ADS 2012.
http://muehlhaus.com/?p=1411
If you have any feedback, comments or questions, please post them here!
Best regards
Volker
Nice method, clean and easy ...but this approach requires some initial setup work, to configure via merging once for a library or PDK. Now, I have created software to automate that initial setup work for you. The Retrofit Viamerge tool lets you choose an existing substrate definition in your workspace or PDK, and automaticaly creates a new substrate version for automatic viamerging, with all the derived layer setup. This makes it very easy to add via merging with derived layers to an existing library or PDK, without cumbersome manual setup.
The tool is available free of charge, and works with ADS 2012.08 or newer.
More info:
http://muehlhaus.com/support/ads-application-notes/retrofit-viamerge