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[WMV] ADS2011 Multi-technology介紹

Question asked by Lin_Ming_Chih Employee on Dec 13, 2012

以往只針對die,package,pcb單獨做EM模擬,現今的趨勢是結合die,package,pcb一起做電磁模擬,這需要整併不同設計圖面及堆疊設定,操作相當繁複,ADS2011提供nested technology的設定流程可大幅簡化其設定  

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