Hi, everyone.
as for my package simulation, in the first step, for simplicity,
I used sheet body for the printed wiring. Now, I would like to
take the the wiring thickness into account. Therefore, I modified
the sheet to thicken it to several micrometers. Therefore,
the structure goes like this,
bottom layer, the ceramic, with thickness of 0.2 mm
sandwiched wiring , with thickness of 0.005 mm
upper layer, the ceramic, with thickness of 0.2 mm.
My question is that, to do it precisely, it is required to make bottom ceramic,
sandwiched wiring, top ceramic, finally stuff the in between air gap with ceramic.
Would this affect the calculation time greatly?
Or if I simply leave the air gap there, the results would be varying greatly?
Or if I just make the upper ceramic closely attached to the bottom ceramic,
leaving no air gap in between, would the result be credible?
With my great appreciations!
as for my package simulation, in the first step, for simplicity,
I used sheet body for the printed wiring. Now, I would like to
take the the wiring thickness into account. Therefore, I modified
the sheet to thicken it to several micrometers. Therefore,
the structure goes like this,
bottom layer, the ceramic, with thickness of 0.2 mm
sandwiched wiring , with thickness of 0.005 mm
upper layer, the ceramic, with thickness of 0.2 mm.
My question is that, to do it precisely, it is required to make bottom ceramic,
sandwiched wiring, top ceramic, finally stuff the in between air gap with ceramic.
Would this affect the calculation time greatly?
Or if I simply leave the air gap there, the results would be varying greatly?
Or if I just make the upper ceramic closely attached to the bottom ceramic,
leaving no air gap in between, would the result be credible?
With my great appreciations!
EMPro allows to have overlapped objects
It is not necessary to subtract objects out from each other with Boolean operations.
However a proper material assignment must be made not to get bogus simulation results.
Also, meshing priority should be set accordingly for the overlapped materials.