Here’s something that shouldn’t come as a shock to you: data rates are increasing. In fact, multi-gigabit data rates for modern network infrastructure and devices aren’t just an occasional occurrence, they are now the norm. As those data rates increase, you would expect that your electromagnetic (EM) simulation continues to deliver accurate results, but that isn’t always the case. Consequently, picking the right EM technology is now all the more important.
In that regard, you have a few options. Full-wave general purpose EM simulation tools, for example, can be used to achieve the desired accuracy. Faster hybrid simulators, specifically tuned to the requirements of low-GHz applications, can also be used. However, the scale and complexity of today’s PCB designs limits the effectiveness of the 3D-EM simulation; especially when it comes to signal integrity (SI) analysis. If the PCBs are densely routed, it may take hours of engineering time to manually simplify a layout, cookie-cut the signal nets, and optimize the meshing to achieve accurate results. Worse yet, there is always the question of whether or not the simulation correlates well with measurement and if any EM effects were missed?
What’s the solution to these challenges? For those SI engineers looking for an answer, an EM analysis solution specifically targeted at dealing with high-speed links on large, complex high-speed PCBs is a good place to start.
Figure 1. With ADS’s SIPro, signal analysis can be completed in just a fraction of the time it would take using a more traditional approach.
SI EM analysis, available in ADS 2016 SIPro solution, utilizes composite EM technology to deliver pure-EM analysis. By doing so, it captures all relevant EM effects, such as via-via coupling and via to microstrip transitions. A net-driven interface allows you to select only those nets you want to simulate, along with the relevant power and ground planes, as well as components. With no engineering effort or time needed on your part to manually edit or manipulate layout objects, you can quickly perform EM simulation. You can even automatically set up ports. It’s a workflow that can take you from layout to results in under 20 clicks (Figure 1).
Figure 2. SIPro delivers results approaching the accuracy of full-wave 3D-EM solutions, but in a fraction of the time.
Once EM simulation is finished, you can plot the S-parameters, TDR/TDT and crosstalk to quickly determine if your EM model is sufficiently characterized and if your channel is performing as expected (Figure 2). Furthermore, with a single-click, automatic schematic generation back-annotates the EM model, making it ready for you to use in both transient and channel simulations.
For more information on overcoming this and other signal integrity or power integrity challenges, check out 8 Ways ADS 2016 Helps You Overcome Signal and Power Integrity Challenges.